Chinese tech company you never heard of may have forced Samsung’s hands to sign patent deal for next generation flash

Daily Zen Mews


Samsung has signed an agreement with China’s YMTC to use its hybrid bonding tech The move will prevent infringement claims in production of 400-layer NAND US-China trade tensions may also have influenced the agreement Samsung Electronics has signed a contract with Yangtze Memory Technologies Co. (YMTC) which will allow it to use the Chinese semiconductor company’s bonding technology in the production of its 400-layer NAND flash memory. Founded in 2016 and headquartered in Wuhan, China, YMTC is a subsidiary of Tsinghua Unigroup, which is backed by the Chinese government. It focuses on 3D NAND flash memory, a critical component in…




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